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A Novel Channel Characteristics Estimation Methodology for High-Speed SerDes Interface on Flip-Chip Ball Grid Array Packages
Ho, Cheng-Yu, Cheng, Hung-Hsiang, Pan, Po-Chih, Wang, Chen-Chao, Hung, Chih-PinVolume:
5
Langue:
english
Journal:
IEEE Transactions on Components, Packaging and Manufacturing Technology
DOI:
10.1109/tcpmt.2015.2478480
Date:
December, 2015
Fichier:
PDF, 2.98 MB
english, 2015