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Failure Analysis of Halogen-Free Printed Circuit Board Assembly Under Board-Level Drop Test
Chang, Hung-Jen, Zhan, Chau-Jie, Chang, Tao-Chih, Chou, Jung-HuaVolume:
134
Année:
2012
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.4005956
Fichier:
PDF, 3.12 MB
english, 2012