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Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies
Park, Ji Eun, Jasiuk, Iwona, Zubelewicz, AlekVolume:
125
Année:
2003
Langue:
english
Journal:
Journal of Electronic Packaging
DOI:
10.1115/1.1527656
Fichier:
PDF, 597 KB
english, 2003