[ASME ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems - Portland, Oregon, USA (July 6–8, 2011)] ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1 - Lead Free Flip Chip Reliability for Various Package Types
Islam, Nokibul, Jimarez, Miguel, Syed, Ahmer, Hwang, TaeKyeong, Gim, JaeYun, Kang, WonJoonAnnée:
2011
Langue:
english
DOI:
10.1115/IPACK2011-52260
Fichier:
PDF, 1.61 MB
english, 2011