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SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, CA (Sunday 22 February 2009)] Design for Manufacturability through Design-Process Integration III - Variability aware interconnect timing models for double patterning
Chin, Eric Y., Neureuther, Andrew R., Singh, Vivek K., Rieger, Michael L.Volume:
7275
Année:
2009
Langue:
english
DOI:
10.1117/12.814281
Fichier:
PDF, 1.18 MB
english, 2009