
Addition of SiC Particles to Ag Die-Attach Paste to Improve High-Temperature Stability; Grain Growth Kinetics of Sintered Porous Ag
Zhang, Hao, Nagao, Shijo, Suganuma, KatsuakiVolume:
44
Langue:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-015-3919-x
Date:
October, 2015
Fichier:
PDF, 2.42 MB
english, 2015