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SPIE Proceedings [SPIE International Conference on Optical Instrumentation and Technology - Shanghai, China (Monday 19 October 2009)] 2009 International Conference on Optical Instruments and Technology: Advanced Sensor Technologies and Applications - Analysis of packaging material impacting on FBG temperature sensors
Wang, Wen-hua, Feng, Yun-jun, Shi, Wen-qing, Xiong, Zheng-ye, Li, Si-dong, Wu, Wei-na, Lin, Jun-xiu, Liao, YanBiao, Wang, Anbo, Wang, Tingyun, Ishii, YukihiroVolume:
7508
Année:
2009
Langue:
english
DOI:
10.1117/12.837814
Fichier:
PDF, 272 KB
english, 2009