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[IEEE 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Changsha, China (2015.8.11-2015.8.14)] 2015 16th International Conference on Electronic Packaging Technology (ICEPT) - Status and Trend of SiC Power Semiconductor Packaging
Wang, Yangang, Dai, Xiaoping, Liu, Guoyou, Wu, Yibo, Li, Daohui, Jones, SteveAnnée:
2015
Langue:
english
DOI:
10.1109/ICEPT.2015.7236613
Fichier:
PDF, 2.02 MB
english, 2015