Integration of robust fluidic interconnects using metal to glass anodic bonding
Briand, Danick, Weber, Patrick, Rooij, Nicolaas F deVolume:
15
Langue:
english
Journal:
Journal of Micromechanics and Microengineering
DOI:
10.1088/0960-1317/15/9/007
Date:
September, 2005
Fichier:
PDF, 1.12 MB
english, 2005