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[IEEE 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - San Diego, CA, USA (2015.5.26-2015.5.29)] 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) - Study of new alloy composition for solder balls - Identifying material properties as key leading indicators toward improved board level performance
Alvarado, Rey, Keser, Beth, Zhou, Eric, Schwarz, Mark, Bezuk, Steve, Wang, Henry, Heng, Kok-LinAnnée:
2015
Langue:
english
DOI:
10.1109/ECTC.2015.7159835
Fichier:
PDF, 2.91 MB
english, 2015