Ternary intermetallic compounds in Au–Sn soldering systems—structure and properties
Müller, Carola J., Bushlya, Volodymyr, Ghasemi, Masoomeh, Lidin, Sven, Valldor, Martin, Wang, FeiVolume:
50
Langue:
english
Journal:
Journal of Materials Science
DOI:
10.1007/s10853-015-9352-y
Date:
December, 2015
Fichier:
PDF, 3.08 MB
english, 2015