Room temperature electroless plating copper seed layer process for damascene interlevel metal structures
Joseph P O’Kelly, Karen F Mongey, Yveline Gobil, Joaquin Torres, Patrick V Kelly, Gabriel M CreanVolume:
50
Année:
2000
Langue:
english
Pages:
7
DOI:
10.1016/s0167-9317(99)00317-2
Fichier:
PDF, 776 KB
english, 2000