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Physical and electrical characterization of ALCVD™ TiN and WNxCy used as a copper diffusion barrier in dual damascene backend structures (08.2)
Steven Smith, Wei-Min Li, Kai-Erik Elers, Klaus PfeiferVolume:
64
Année:
2002
Langue:
english
Pages:
7
DOI:
10.1016/s0167-9317(02)00796-7
Fichier:
PDF, 742 KB
english, 2002