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Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics
Hirose, Akio, Takeda, Naoya, Konaka, Yosuke, Tatsumi, Hiroaki, Akada, Yusuke, Ogura, Tomo, Ide, Eiichi, Morita, ToshiakiVolume:
706-709
Langue:
english
Journal:
Materials Science Forum
DOI:
10.4028/www.scientific.net/msf.706-709.2962
Date:
January, 2012
Fichier:
PDF, 1.16 MB
english, 2012