Mapping stresses in high aspect ratio polysilicon electrical through-wafer interconnects
Sharma, Himani, Krabbe, Joshua D., Farsinezhad, Samira, van Popta, Andy C., Wakefield, Nick G., Fitzpatrick, Glen A., Shankar, KarthikVolume:
14
Langue:
english
Journal:
Journal of Micro/Nanolithography, MEMS, and MOEMS
DOI:
10.1117/1.JMM.14.2.024001
Date:
June, 2015
Fichier:
PDF, 2.38 MB
english, 2015