Journal of Vacuum Science & Technology B Microelectronics and Nanometer Structures
2002 Vol. 20; Iss. 5
Improved TaN barrier layer against Cu diffusion by formation of an amorphous layer using plasma treatment
Ou, Keng-Liang, Wu, Wen-Fa, Chou, Chang-Pin, Chiou, Shi-Yung, Wu, Chi-ChangVolume:
20
Année:
2002
Langue:
english
Journal:
Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures
DOI:
10.1116/1.1511214
Fichier:
PDF, 626 KB
english, 2002