SPIE Proceedings [SPIE SPIE Advanced Lithography - San Jose, California, United States (Sunday 22 February 2015)] Advanced Etch Technology for Nanopatterning IV - Trench and hole patterning with EUV resists using dual frequency capacitively coupled plasma (CCP)
Lin, Qinghuang, Engelmann, Sebastian U., Zhang, Ying, Feurprier, Yannick, Lutker-Lee, Katie, Rastogi, Vinayak, Matsumoto, Hiroie, Chiba, Yuki, Metz, Andrew, Kumar, Kaushik, Beique, Genevieve, Labonte,Volume:
9428
Année:
2015
Langue:
english
DOI:
10.1117/12.2086519
Fichier:
PDF, 2.57 MB
english, 2015
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