[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Reliability of Au-Si eutectic bonding
Ye, Tianxiang, Song, Zhen, Du, Yuxin, Wang, ZheyaoAnnée:
2014
Langue:
english
DOI:
10.1109/icept.2014.6922833
Fichier:
PDF, 459 KB
english, 2014