
Silver stress migration bonding driven by thermomechanical stress with various substrates
Oh, Chulmin, Nagao, Shijo, Suganuma, KatsuakiVolume:
26
Langue:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-2717-9
Date:
April, 2015
Fichier:
PDF, 1016 KB
english, 2015