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Influence of temperature on MWCNT bundle, SWCNT bundle and copper interconnects for nanoscaled technology nodes
Singh, Karmjit, Raj, BalwinderVolume:
26
Langue:
english
Journal:
Journal of Materials Science: Materials in Electronics
DOI:
10.1007/s10854-015-3193-y
Date:
August, 2015
Fichier:
PDF, 827 KB
english, 2015