SPIE Proceedings [SPIE Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS - Paris, France (Tuesday 9 May 2000)] Design, Test, Integration, and Packaging of MEMS/MOEMS - THERMODEL: a tool for thermal model generation and application for MEMS packages
Szekely, Vladimir, Rencz, Marta, Poppe, Andras, Courtois, Bernard, Courtois, Bernard, Crary, Selden B., Gabriel, Kaigham J., Karam, Jean Michel, Markus, Karen W., Tay, Andrew A. O.Volume:
4019
Année:
2000
Langue:
english
DOI:
10.1117/12.382288
Fichier:
PDF, 975 KB
english, 2000
File converter
Plus de résultats de recherche
More benefits 
