Mechanism of via failure in copper/organosilicate glass interconnects induced by oxidation
Woo Sig Min, Dong Joon Kim, Sung Gyu Pyo, Sang Jong Park, Jin Tae Choi, Sibum KimVolume:
515
Année:
2007
Langue:
english
Pages:
6
DOI:
10.1016/j.tsf.2006.10.109
Fichier:
PDF, 1.03 MB
english, 2007