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Formation of titanium nitride barrier layer in nickel–titanium shape memory alloys by nitrogen plasma immersion ion implantation for better corrosion resistance
Ray W.Y. Poon, Joan P.Y. Ho, Xuanyong Liu, C.Y. Chung, Paul K. Chu, Kelvin W.K. Yeung, William W. Lu, Kenneth M.C. CheungVolume:
488
Année:
2005
Langue:
english
Pages:
6
DOI:
10.1016/j.tsf.2005.04.002
Fichier:
PDF, 232 KB
english, 2005