Alternative etching gases to SF6 for plasma enhanced chamber cleaning in silicon deposition systems
T. Rößler, M. Albert, R. Terasa, J.W. BarthaVolume:
200
Année:
2005
Langue:
english
Pages:
4
DOI:
10.1016/j.surfcoat.2005.02.183
Fichier:
PDF, 104 KB
english, 2005