ECS Transactions [ECS China Semiconductor Technology International Conference 2010 (CSTIC 2010) - Shanghai, China (March 18 - March 19, 2010)] - Effect of Plating and Anneal Processes on Properties of Electroplated Copper Films
Liu, Sheng, Yang, Rui-Peng, Nie, Jiaxiang, He, Weiye, Kong, Xiang-Tao, Kang, YunAnnée:
2010
Langue:
english
DOI:
10.1149/1.3360712
Fichier:
PDF, 188 KB
english, 2010