Copper polishing with a polishing pad incorporating abrasive grains and a chelating resin
Makoto Sato, Tetsuya Kameyama, Toru NonamiVolume:
33
Année:
2009
Langue:
english
Pages:
8
DOI:
10.1016/j.precisioneng.2008.05.007
Fichier:
PDF, 1.27 MB
english, 2009