Tantalum diffusion barrier grown by inorganic plasma-promoted chemical vapor deposition: Performance in copper metallization
Kaloyeros, Alain E., Chen, Xiomeng, Lane, Sarah, Frisch, Harry L., Arkles, BarryVolume:
15
Langue:
english
Journal:
Journal of Materials Research
DOI:
10.1557/JMR.2000.0400
Date:
December, 2000
Fichier:
PDF, 965 KB
english, 2000