[IEEE 2014 International Conference on Planarization/CMP Technology (ICPT) - Kobe, Japan (2014.11.19-2014.11.21)] Proceedings of International Conference on Planarization/CMP Technology 2014 - Silicon nitride stop layer in back-end-of-line planarization for wafer bonding application
Lisker, Marco, Trusch, Andreas, Kruger, Andreas, Fraschke, Mirko, Tillack, Bernd, Weimann, Nils, Ostermay, Ina, Kruger, OlafAnnée:
2014
Langue:
english
DOI:
10.1109/icpt.2014.7017258
Fichier:
PDF, 1.79 MB
english, 2014