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Estimation of thermal parameters of the enclosed electronic package system by using dynamic thermal response
Jung-Kyun Kim, Wataru Nakayama, Yoshimi Ito, Sang-mo Shin, Sun-Kyu LeeVolume:
19
Année:
2009
Langue:
english
Pages:
7
DOI:
10.1016/j.mechatronics.2009.06.013
Fichier:
PDF, 1.16 MB
english, 2009