Barrier Capability of Hf-N Films with Various Nitrogen Concentrations Against Copper Diffusion in Cu/Hf-N/n[sup +]-p Junction Diodes
Ou, Keng-Liang, Chiou, Shi-Yung, Lin, Ming-Hongn, Hsu, Ray-QuanVolume:
152
Année:
2005
Langue:
english
Journal:
Journal of The Electrochemical Society
DOI:
10.1149/1.1850367
Fichier:
PDF, 1.01 MB
english, 2005