Advanced Cu chemical displacement technique for SiO2-based electrochemical metallization ReRAM application
Chin, Fun-Tat, Lin, Yu-Hsien, You, Hsin-Chiang, Yang, Wen-Luh, Lin, Li-Min, Hsiao, Yu-Ping, Ko, Chum-Min, Chao, Tien-ShengVolume:
9
Année:
2014
Langue:
english
Journal:
Nanoscale Research Letters
DOI:
10.1186/1556-276X-9-592
Fichier:
PDF, 1.67 MB
english, 2014