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Interfacial Microstructure Evolution Between Sn-Zn Solders and Ag Substrate During Solid-State Annealing
Wang, Chao-hong, Li, Po-yi, Li, Kuan-tingVolume:
43
Langue:
english
Journal:
Journal of Electronic Materials
DOI:
10.1007/s11664-014-3358-0
Date:
December, 2014
Fichier:
PDF, 3.45 MB
english, 2014