[IEEE 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Orlando, FL, USA (2014.5.27-2014.5.30)] 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) - Development of a high density glass interposer based on wafer level packaging technologies
Topper, Michael, Wohrman, Markus, Brusberg, Lars, Jurgensen, Nils, Ndip, Ivan, Lang, Klaus-DieterAnnée:
2014
Langue:
english
DOI:
10.1109/ectc.2014.6897492
Fichier:
PDF, 3.44 MB
english, 2014