[IEEE 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - Tokyo, Japan (2014.7.15-2014.7.16)] 2014 4th IEEE International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D) - New bonding material for power devices with high bonding strength for operating high temperature
Sekine, Shigenobu, Kimura, Ryuji, Okada, Keiji, Shindo, Hiroaki, Ooi, Tatsuya, Itoh, UichiAnnée:
2014
Langue:
english
DOI:
10.1109/ltb-3d.2014.6886188
Fichier:
PDF, 227 KB
english, 2014