A method of investigating fine shorting whiskers within a leadframe molded package
Yen, A.C., Zheng Hongyu,, Wynn, R.T., Zhang Yaohui,, Lingfai Wang,Volume:
24
Langue:
english
Journal:
IEEE Transactions on Advanced Packaging
DOI:
10.1109/6040.909632
Date:
January, 2001
Fichier:
PDF, 166 KB
english, 2001