IEEE Transactions on Components Packaging and Manufacturing Technology Part B
1997 / 5 Vol. 20; Iss. 2
The effect of the oxidation of Cu-base leadframe on the interface adhesion between Cu metal and epoxy molding compound
Soon-Jin Cho,, Kyung-Wook Paik,, Young-Gil Kim,Volume:
20
Langue:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
DOI:
10.1109/96.575569
Date:
May, 1997
Fichier:
PDF, 182 KB
english, 1997