[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Contact resistance investigation of electrical connector with different shrink range
Duan, Ke, Zhu, Fulong, Li, Ying, Tang, Kai, Liu, Sheng, Chen, YanmingAnnée:
2014
Langue:
english
DOI:
10.1109/icept.2014.6922846
Fichier:
PDF, 574 KB
english, 2014