[IEEE 56th Electronic Components and Technology Conference 2006 - San Diego, CA (May 30 - June 2, 2006)] 56th Electronic Components and Technology Conference 2006 - Thermal Properties of Oxide Free Nano Non Noble Metal for Low Temperature Interconnect Technology
Hongjin Jiang,, Kyoung-sik Moon,, Hua, F., Wong, C.P.Année:
2006
Langue:
english
DOI:
10.1109/ectc.2006.1645930
Fichier:
PDF, 1.56 MB
english, 2006