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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Advancements in Package-on-Package (PoP) technology, delivering performance, form factor & cost benefits in next generation Smartphone processors
Eslampour, Hamid, Joshi, Mukul, Park, SeongWon, Shin, HanGil, Chung, JaeHanAnnée:
2013
Langue:
english
DOI:
10.1109/ectc.2013.6575824
Fichier:
PDF, 905 KB
english, 2013