[IEEE 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT-HDP) - Guilin, Guangxi, China (2012.08.13-2012.08.16)] 2012 13th International Conference on Electronic Packaging Technology & High Density Packaging - Investigation on FBGA block warpage by Finite Element Simulation
Li, Jinrui, Tan, Lin, Wang, Qian, Cai, Jian, Yu, Guoliang, Wang, Shuidi, Cheng, XiyunAnnée:
2012
Langue:
english
DOI:
10.1109/icept-hdp.2012.6474838
Fichier:
PDF, 1.05 MB
english, 2012