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[IEEE 2014 International Conference on Electronics Packaging (ICEP) - Toyama, Japan (2014.4.23-2014.4.25)] 2014 International Conference on Electronics Packaging (ICEP) - Study on an interconnect technology toward flexible printed electronics
Mitsui, Ryosuke, Takahashi, Seiya, Nakajima, Shin-ichiro, Nomura, Ken-ichi, Ushijima, HirobumiAnnée:
2014
Langue:
english
DOI:
10.1109/icep.2014.6826702
Fichier:
PDF, 2.46 MB
english, 2014