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[IEEE 2014 15th International Conference on Electronic Packaging Technology (ICEPT) - Chengdu, China (2014.8.12-2014.8.15)] 2014 15th International Conference on Electronic Packaging Technology - Research on mobility variance caused by TSV-induced mechanical stress in 3D-IC
Zhao, Yangyang, You, Hailong, Cui, Ran, Zhang, Yu, Jia, XinzhangAnnée:
2014
Langue:
english
DOI:
10.1109/icept.2014.6922855
Fichier:
PDF, 357 KB
english, 2014