IEEE Transactions on Components Packaging and Manufacturing Technology Part A
1995 / 3 Vol. 18; Iss. 1
A boundary element formulation of the conjugate heat transfer from a convectively cooled discrete heat source mounted on a conductive substrate
Kabir, H., Ortega, A., Cho Lik Chan,Volume:
18
Langue:
english
Journal:
IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A
DOI:
10.1109/95.370743
Date:
March, 1995
Fichier:
PDF, 742 KB
english, 1995