Process design for transfer moulding of electronic packages using a case-based reasoning approach with fuzzy regression adaptation
Tong, Kw, Kwong, Ck, Chan, CyVolume:
18
Langue:
english
Journal:
International Journal of Computer Integrated Manufacturing
DOI:
10.1080/09511920412331284771
Date:
January, 2005
Fichier:
PDF, 242 KB
english, 2005