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[IEEE 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC) - Las Vegas, NV, USA (2013.05.28-2013.05.31)] 2013 IEEE 63rd Electronic Components and Technology Conference - Towards alternative technologies for fine pitch interconnects
Colonna, J P, Segaud, R, Marion, F, Volpert, M, Garnier, A, Di Cioccio, L, Beillard, Y, Mermoz, S, De Crecy, F, Laviron, C, Cheramy, S.Année:
2013
Langue:
english
DOI:
10.1109/ectc.2013.6575676
Fichier:
PDF, 1.64 MB
english, 2013