[IEEE 2013 14th International Conference on Electronic Packaging Technology (ICEPT) - Dalian, China (2013.08.11-2013.08.14)] 2013 14th International Conference on Electronic Packaging Technology - The effects of creep on electromigration behaviors in Sn-based Pb-free solder joints
Zuo, Yong, Ma, Limin, Wan, Ting, Qiao, Lei, Liu, Sihan, Guo, FuAnnée:
2013
Langue:
english
DOI:
10.1109/icept.2013.6756582
Fichier:
PDF, 2.22 MB
english, 2013