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[IEEE Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems - Las Vegas, NV, USA (20-24 Jan. 2002)] Technical Digest. MEMS 2002 IEEE International Conference. Fifteenth IEEE International Conference on Micro Electro Mechanical Systems (Cat. No.02CH37266) - A novel low-loss wafer-level packaging of the RF-MEMS devices
Yun-Kwon Park,, Heung-Woo Park,, Duck-Jung Lee,, Jung-Ho Park,, In-Sang Song,, Chung-Woo Kim,, Ci-Moo Song,, Yun-Hi Lee,, Chul-Ju Kim,, Byeong Kwon Ju,Année:
2002
Langue:
english
DOI:
10.1109/memsys.2002.984362
Fichier:
PDF, 486 KB
english, 2002