[IEEE High Density Packaging (ICEPT-HDP) - Xi'an, China (2010.08.16-2010.08.19)] 2010 11th International Conference on Electronic Packaging Technology & High Density Packaging - Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration
Lu, Yu-Dong, En, Yun-Fei, He, Xiao-Qi, Gang Niu,, Pecht, Michael, Xin Wang,Année:
2010
Langue:
english
DOI:
10.1109/icept.2010.5582683
Fichier:
PDF, 961 KB
english, 2010