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[IEEE 2007 Proceedings 57th Electronic Components and Technology Conference - Sparks, NV, USA (2007.05.29-2007.06.1)] 2007 Proceedings 57th Electronic Components and Technology Conference - High Density PoP (Package-on-Package) and Package Stacking Development
Dreiza, Moody, Yoshida, Akito, Ishibashi, Kazuo, Maeda, TadashiAnnée:
2007
Langue:
english
DOI:
10.1109/ectc.2007.373977
Fichier:
PDF, 3.52 MB
english, 2007