
[IEEE 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) - Suzhou, Jiangsu, China (2009.07.6-2009.07.10)] 2009 16th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits - Hot electron stress effect on dual-band power amplifier and integrated mixer-lna design for reliability
Yuan, J.S., Ma, J., Hsu, C.W., Yeh, W.K.Année:
2009
Langue:
english
DOI:
10.1109/ipfa.2009.5232674
Fichier:
PDF, 5.03 MB
english, 2009